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The effect of bi presence as impurities in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

机译：阳极铜中Bi存在作为杂质对铜的阳极溶解和阴极沉积动力学和机理的影响

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Stanković Zvonimir D.; Cvetkovski Vladimir B.; Grekulović Vesna J.;
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1. The effect of bi presence as impurities in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper [J] . Stankovi? Zvonimir D., Cvetkovski Vladimir B., Grekulovi? Vesna J. Hemijska industrija . 2010,第4期

机译：阳极铜中作为杂质的Bi的存在对铜阳极溶解和阴极沉积动力学及机理的影响
2. The Effect of Tellurium Presence in Anodic Copper on Kinetics and Mechanism of Anodic Dissolution and Cathodic Deposition of Copper [J] . Zvonimir D. Stankovic, Vladimir B. Cvetkovski, Vesna J. Grekulovic, International Journal of Electrochemical Science . 2013,第5期

机译：阳极铜中碲的存在对铜阳极溶解和阴极沉积动力学及机理的影响
3. The effect of antimony presence in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper [J] . Stankovi? Z.D., Cvetkovski V., Vukovi? M. Journal of Mining and Metallurgy, Section B: Metallurgy . 2008,第1期

机译：阳极铜中锑的存在对铜阳极溶解和阴极沉积动力学及机理的影响
4. Effect of PEG(Polyethylene glycol)on the anodic dissolution of copper in acid copper electrodeposition baths [C] . Ki-Deok Song, Kwang-Bum Kim The Meeting of the Electrochemical Society . 2001

机译：PEG（聚乙二醇）对酸铜电沉积浴铜阳极溶解的影响
5. An electrochemical study of mass transfer in high-rate anodic dissolution of copper. [D] . Vidal, Roberto W. 1995

机译：高速阳极铜溶解过程中传质的电化学研究。
6. Light-IrradiatedElectrochemical Direct Constructionof Cu2O/CuO Bilayers by Switching Cathodic/Anodic Polarizationin Copper(II)–Tartrate Complex Aqueous Solution [O] . Masanobu Izaki, Takayuki Koyama, Pei Loon Khoo, 2020

机译：光照射电化学直接施工阴极/阳极极化转换制备Cu2O / CuO双层膜酒石酸铜（II）络合物水溶液中的含量
7. The effect of bi presence as impurities in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper [O] . Stanković Zvonimir D., Cvetkovski Vladimir B., Grekulović Vesna J. 2010

机译：阳极铜中Bi存在作为杂质对铜的阳极溶解和阴极沉积动力学和机理的影响
8. PERIODIC PHENOMENA IN THE HIGH CURRENT DENSITY ANODIC DISSOLUTION OF COPPER [R] . John Frederick Cooper 1975

机译：铜的高电流密度阳极溶解过程中的周期现象

The effect of bi presence as impurities in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

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